N_2对Sn-Ag-Cu钎料与元器件引线无铅镀层润湿性的影响  

Effect of N_2 on wettability of Sn-Ag-Cu solder on components/devices lead frame and lead-free coating

作　　者：刘琳[1] 薛松柏[1] 许文达[1] 姚立华[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2005年第10期47-50,共4页Transactions of The China Welding Institution

摘　　要：以Sn-3.5Ag-0.5Cu钎料主要研究对象,配合免清洗助焊剂,基于润湿平衡原理测量了钎料对Sn、Sn-Cu、Sn-Bi三种镀层的润湿特性,研究了五种温度、三种镀层、两种气氛条件对润湿行为的影响.结果表明,空气气氛下,温度较低时Sn-Bi镀层的润湿性能相对较好,温度较高时三种镀层的润湿性相当;采用氮气保护后可明显改善钎料润湿性,润湿时间缩短22%～40%,同一温度下的三种镀层的润湿性能相当.Wetting properties of Sn-3.5Ag-0.5Cu solder with no-clean flux on Sn, Sn-Cu, Sn-Bi coatings were tested and studied on the basis of wetting balance principle under the conditions of five temperature, three kinds of coatings and two atmospheres. The results indicate that the wettability of Sn-Bi coating in air at lower temperature is prefect, but they are almost same at higher temperature for the wettability of three coatings. The wettability can be obviously improved and the wetting time is reduced by 22%∼40% in N2 atmosphere and the wettability of Sn-3.5Ag-0.5Cu solder on three kinds of coatings is nearly same at the same temperature.

关 键 词：无铅钎料 无铅镀层 润湿性 

分 类 号：TG454[金属学及工艺—焊接]