化学镀金属薄膜与磁控溅射的关联性  

Relationship between plating and magnetron sputtering for metallic films

作　　者：唐武[1] 邓龙江[1] 徐可为[2] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054 [2]西安交通大学金属材料强度国家重点实验室,西安710049

出　　处：《中国有色金属学报》2005年第11期1822-1826,共5页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金重点资助项目(59931010);科技部中法先进研究计划资助项目(PRAMX9906)

摘　　要：采用原子力显微镜和X射线衍射仪研究了Al2O3基体上磁控溅射Au/NiCr/Ta多层金属膜基础上化学镀Au膜的生长形貌、晶体取向和残余应力,并与磁控溅射Au膜进行了对比。结果表明:通过化学镀工艺生长的Au膜延续了磁控溅射薄膜柱状晶结构生长的特点,但薄膜生长颗粒出现聚合现象,磁控溅射Au膜的颗粒尺寸约为60 nm,化学镀Au膜尺寸可增加到400 nm左右;化学镀薄膜在磁控溅射薄膜基础上表面粗糙度增大,化学镀工艺对磁控溅射金属薄膜的晶体取向具有承继性,并伴随有晶体取向择优生长的“放大”作用,但对残余应力则有一定的调节作用。Au/NiCr/Ta multi-layered metal films were deposited on AI2 （）~ substrate by magnetron sputtering and then Au film was chemically plated. The crystal orientation, residual stress and surface morphology were investigated, and comparison was made between plating and magnetron sputtering technology by X-ray diffractrometry and atomic force microscopy. Au grain increases from 60 to 400 nm after plating. The results indicate that the plating technology can inherit the crystal orientation from magnetron sputtering, enlarge the preferred orientation, and har monize the residual stress. The surface roughness of Au films increases after plating.

关 键 词：金属薄膜 磁控溅射 化学镀 关联性 原子力显微镜 X射线衍射仪 生长形貌 晶体取向 残余应力 

分 类 号：O484.1[理学—固体物理]