新型无铅焊料Sn-Ag-Cu-Cr-X的性能研究  

Property of New Type Lead-Free Solder Sn-Ag-Cu-Cr-X

作　　者：刘静[1] 徐骏[1] 张富文[1] 杨福宝[1] 朱学新[1] 

机构地区：[1]北京有色金属研究总院国家复合材料工程技术研究中心,北京100088

出　　处：《稀有金属》2005年第5期625-630,共6页Chinese Journal of Rare Metals

基　　金：国家863高技术研究发展计划项目资助(2003AA3Z1420)

摘　　要：传统的SnPb钎料由于Pb的毒性即将被禁止在微电子连接上使用,加上现在集成电路小型化、微型化以及高密度化的趋势;对所要开发的无铅钎料性能要求愈来愈高。以Sn-3.0Ag-0.5Cu钎料为母合金,添加了不同含量的合金元素Cr以及微量的合金元素Al或P,得到了一种新的Sn-3.0Ag-0.5Cu-Cr-P,测得熔点在217℃左右,抗拉强度达46 MPa,电导率在8.2(106S.m-1)以上,并具有很好的抗氧化性能。The traditional Sn-Pb solders used in micro-electronic connection materials will be restrizted because of the lead＇s toxicity, and integrate circuit is be coming more and more little and high-density, which need developing a high property Pb-free solder. A new Sn3.0Ag0.5Cu-based Pb-free solder is studied in this paper, through adding different content alloyelement Cr and micro-alloy element Al or P that acquire a new Sn-3.0Ag-0.5Cu-Cr-P lead-free solder. By testing show that solder＇s melting point is about 217 ℃, tensile strength get to 40 MPa, conductance over 8.2 （ 106 S·m^-1 ） and the solder has good anti-oxidation.

关 键 词：无铅钎料 微合金化 焊接性能 抗氧化性 

分 类 号：TN604[电子电信—电路与系统]