三维多芯片组件的散热分析  

An Investigation into Heat Dissipation Analysis of the 3D-MCM

作　　者：蒋长顺[1] 谢扩军[1] 许海峰[1] 朱琳[1] 

机构地区：[1]电子科技大学物理电子学院,四川成都610054

出　　处：《电子与封装》2005年第11期21-25,共5页Electronics & Packaging

摘　　要：建立了一种叠层多芯片组件结构，应用计算流体动力学方法(CFD)，对金刚石基板的三维多芯片结构进行了散热分析，模拟了器件在强制空气冷却条件下的热传递过程和温度分布。此外，还探讨了各种设计参数和物性参数对3D-MCM器件温度场的影响。A stacked MCM model was developed, computational fluid dynamics solution was utilized to proceed the thermal dissipation analysis of the stacked MCM with CVD-diamond substrates, to simulate the heat transfer process and the temperature distribution of the MCM under forced air-cooling conditions, and the effects of different factors on the 3D-MCM temperature distribution are investigated, the affecting parameters include thermophysical properties and design structural properties.

关 键 词：计算流体动力学 3D-MCM 

分 类 号：TN305.94[电子电信—物理电子学]