10Gb/s电吸收调制器的微波封装设计  

Microwave Packaging for 10 Gb/s EML Modulators

作　　者：刘宇[1] 谢亮[1] 袁海庆[1] 张家宝[1] 祝宁华[1] 孙长征[2] 熊兵[2] 罗毅[2] 

机构地区：[1]中国科学院半导体研究所集成光电子学国家重点实验室,北京100083 [2]清华大学电子工程系集成光电子学国家重点实验室,北京100084

出　　处：《中国激光》2005年第11期1495-1498,共4页Chinese Journal of Lasers

基　　金：国家973计划(G2000036601);国家863计划(2001AA312030;2001AA312290)资助项目

摘　　要：在高速光电子器件的微波封装过程中,需要综合考虑封装寄生参数和芯片寄生参数对器件高频性能的影响。利用封装寄生参数对芯片寄生参数的补偿作用,成功实现了10 Gb/s电吸收调制激光器(EML)的高频封装。通过封装前后芯片和器件的小信号频率响应测试结果对比,器件的反射参数和传输参数有所改善,3 dB带宽达到10 GHz;并进行了10 Gb/s速率的光纤传输实验,经过40 km光纤传输后通道代价不到1 dBm(误码率为10-12),满足10 Gb/s长距离光纤传输系统的要求。A novel microwave packaging technique for 10 Gb/s electro-absorption modulator integrated with distributed feedback laser （EML） is presented. The packaging parasitic and intrinsic parasitic are both well considered, and the packaging circuit is synthetically designed to compensate the intrinsic parasitic of the chip. A butterfly packaged EMIr module has been successfully developed to approve that. The small-signal modulation bandwidth of the butterfly-packaged module is about 10 GHz. Optical fiber transmission experiments at a data rate of 10 Gb/s show that the module can be used for long-haul transmission. After transmission through 40 km, the power penalty is less than 1 dBm at a hit-error-rate of 10^-12.

关 键 词：光电子学 电吸收调制器 微波封装 频率响应 

分 类 号：TN365[电子电信—物理电子学]