声表面波器件制作中的干法刻蚀工艺  

RIE Technology Employed in the Manufacturing Process of SAW Devices

作　　者：王祥邦[1] 李勇[1] 陈培棣[1] 

机构地区：[1]南京电子器件研究所通讯产品部,江苏南京210016

出　　处：《压电与声光》2005年第6期711-713,共3页Piezoelectrics & Acoustooptics

摘　　要：声表面波器件广泛应用于有线和无线通讯中。利用半导体加工工艺制作声表面波器件,由于所使用的工艺的特殊性,并不能完全按照硅工艺。该文讲述了用干法刻蚀工艺制作声表面波器件及其工艺特殊性。SAW devices are widely applied in wired and wireless communications. It can be produced by standard IC procedure. But the silicon microelectronic technology cannot be wholly employed due to its special technical requirement on the process. This article describes the RIE technology employed in the process and specialty of the process.

关 键 词：反应离子刻蚀 压电材料 叉指换能器 

分 类 号：TN65[电子电信—电路与系统]