基片下磁场对溅射薄膜宏观形貌的影响  

The Influence of the Magnetic Field under the Substrate on the Appearance of the Films

作　　者：储开慧[1] 狄国庆[1,2] 

机构地区：[1]苏州大学物理系,苏州215006 [2]江苏省薄膜材料重点实验室,苏州215006

出　　处：《材料导报》2005年第F11期330-331,共2页Materials Reports

摘　　要：通过屏蔽传统磁控溅射设备阴极内的磁场和在基片下放置永磁铁，使来自基片下的磁场发挥作用，研究了此外加磁场在溅射过程中对薄膜沉积所产生的影响。用这种方法沉积出的Cu、Al的薄膜的宏观形貌为：膜的中央有一圆斑，在圆斑的外围有环。Al薄膜的中央圆斑处没有物质，为空白圆斑；而Cu薄膜的中央圆斑处有物质。对这一实验现象的产生机理，初步认为是成膜粒子在磁场中表现出的波动性。With the shielding of the magnetic field in the cathode of the traditional rnagnetron sputtering apparatus while placing a permanent magnet below the substrate, and letting the magnetic field to take action during sputtering, the effects of the magnetic field on the movements of the sputtered particles during thin film depositions are investigated. It is found that there are characteristic film-thickness distributions on Cu and AI films deposited by this method, like the phenomenon of Fresnel diffraction by a circular aperture in optics. In the center of each film, there is a circular spot, which is surrounded by some loops. But there are differences between the appearance of Cu and AI films. To AI film, the central circular spot is empty. While as far as Cu film is concerned, the film-thickness of the central spot is rather thick. A preliminary discussion is made on the mechanism of this novel phenomenon.

关 键 词：磁控溅射 膜厚 梯度磁场 

分 类 号：TG174.444[金属学及工艺—金属表面处理]