UV-LIGA双层微齿轮加工工艺研究  

Process Study of Fabricating Bi-layer Micro Gears through UV-LIGA Technique

作　　者：张晔[1] 陈迪[1] 潘欣欣[1] 方华斌[1] 朱军[1] 刘景全[1] 

机构地区：[1]上海交通大学微纳科学技术研究院微米/纳米加工技术国家重点实验室薄膜与微细技术教育部重点实验室,上海200030

出　　处：《微细加工技术》2005年第4期69-75,共7页Microfabrication Technology

基　　金：国家科技部863项目资助(2004AA404260)

摘　　要：利用SU-8光刻胶UV-LIGA技术制备了双层微齿轮,齿轮单层的厚度可达450μm。制备中分别采用了三种工艺路线:两次电铸、溅射种子层一次电铸和直接一次电铸,均成功地制备出了双层微齿轮,并讨论了三种工艺路线各自的适用范围,即两次电铸工艺路线适用于对机械强度要求不高的各类多层微结构器件,一次电铸工艺路线适用于对机械强度要求较高的结构,其中溅射种子层工艺适用于深宽比较小的多层微结构模具,而直接电铸工艺适用于深宽比较大且层间直径相差较小的多层微结构器件。The bi-layer micro gears have been fabricated by UV-LIGA technique using SU-8 photoresist. The max thickness of each layer can reach 450μm. Fabrication of these bi-layer gears has been realized through three process schemes, namely separately electroforming, once-electroforming on a seed layer and directly once-electroforming. The advantages and disadvantages of three process schemes are discussed respectively. Separately electroforming process is appropriated for the fabrication of various miocrostructure devices which mechanical demand is not high. Onceelectroforming methods are used in cases where mechanical demand is high. The seed layer onceelectroforming is appropriated for the fabrication of moulds of low aspect ratio microstructures, while the directly once-electroforming is appropriated to the high aspect ratio microstructure devices.

关 键 词：UV-LIGA技术 SU-8胶 双层微齿轮 

分 类 号：TN23[电子电信—物理电子学]