基于模具对IC封装体内部气泡的研究  

Study on Inner Void Generation of IC Package Based on Moulds

作　　者：罗涛[1] 马春翔[1] 

机构地区：[1]上海交通大学机械与动力工程学院

出　　处：《传动技术》2005年第4期24-26,共3页Drive System Technique

摘　　要：由于裸芯片的细小化,加之芯片封装体的“轻、小、短、薄”,封装体内部气泡易产生。根据芯片的SOP结构,通过改变树脂种类及树脂丸与模具料筒间的空隙量,分析和研究影响芯片封装体内部气泡产生的主要因素,为实际生产过程中提供科学依据。Due to both the small-size of chips and the ‘light＇, ‘small＇, ‘short＇ and ‘thin＇ of packages, inner voids are often generated in packages. On the basis of SOP, the influence of the main factors on the inner void generation are analyzed by making experiments with different types ot resin and distances between Tablet and Pot, It can serve as a scientific reference for practical production.

关 键 词：裸芯片 封装体 内部气泡 

分 类 号：TH122[机械工程—机械设计及理论]