功率LED芯片键合材料对器件热特性影响的分析与仿真  

Analysis and simulation of thermal characteristic on die bonding materials of power LED

作　　者：王垚浩 余彬海 李舜勉 

机构地区：[1]广东佛山市国星光电科技有限公司,广东佛山528000

出　　处：《佛山科学技术学院学报（自然科学版）》2005年第4期14-17,共4页Journal of Foshan University(Natural Science Edition)

基　　金：863引导资助项目(2004AA001340);国家十五科技攻关资助项目(2003BA316A01-02-06)

摘　　要：针对倒装型功率发光二极管器件,描述了功率LED器件的热阻特性,对不同芯片键合材料的功率LED热阻进行了分析,并运用AN SY S软件对3类典型芯片键合材料封装的功率LED热特性进行了仿真。仿真结果表明:采用功率芯片键合材料提高了功率LED的散热特性、降低器件PN结温,而采用普通热沉粘接胶作为芯片键合材料的功率LED的PN结温则较高,因此普通热沉粘接胶不适合用作功率LED的芯片键合材料。The thermal resistance characteristic of high power LEDs has been described in this paper in allusion to the flip-chip power light emitting diodes. Thermal resistances of power LEDs packaged in different die bonding materials have been analyzed. Meanwhile, the ANSYS tool has been used in thermal simulations of power LEDs made from three types of die bonding materials . The simulation result shows that using power die bonding material may improve heat conducting abilities and reduce PN junction temperature of power LEDs obviously while using the epoxy resin as die bonding material will result in the ascending of junction temperature. It appears that the epoxy resin couldn＇t be used as die bonding material for power LEDs.

关 键 词：芯片键合 功率LED 热阻 结温 

分 类 号：TN312.8[电子电信—物理电子学]