锡锌合金无铅电子钎料有机活化松香助焊剂  

Organic Activated Rosin-based Flux for Sn-9Zn Lead-free Solders

作　　者：黄起森[1] 魏秀琴[1] 朱君秋[1] 周浪[1] 

机构地区：[1]南昌大学,江西南昌330047

出　　处：《电子工艺技术》2006年第1期44-46,52,共4页Electronics Process Technology

摘　　要：锡锌合金是很有潜力的无铅电子焊料合金,润湿性较差是其发展的主要障碍。研究发现:在传统乙醇松香助焊剂中添加质量分数为0.5%的DMA可显著提高其活性,使Sn-9Zn对铜的润湿力和润湿铺展面积都有显著提高;再加入适当比例的乙二胺可使其改善润湿性的效果进一步提高,并大大减轻助焊剂对Sn-9Zn合金的腐蚀性。Poor wettability is the major barrier in development of Sn - Zn alloy lead - free solders. The present work found that, adding 0.5 % wt DMA to ethanol - rosin can remarkably raise its activity and improve the wettabihiy of Sn - 9Zn to copper when used as a flux. Further addition of minor amount of ethylenediamine to the flux can further improve the wettability, and greatly reduce the corrosivity of the flux to Sn -9Zn alloy.

关 键 词：无铅钎料 SN-9ZN 助焊剂 润湿性 

分 类 号：TN6[电子电信—电路与系统]