移动通信存储MCP器件的最终测试及其有效解决方案  

Final Testing of Mobile Memory MCP Devices and its Effective Solution

作　　者：袁池 

机构地区：[1]安捷伦科技应用开发中心,上海200131

出　　处：《电子工业专用设备》2006年第2期43-48,共6页Equipment for Electronic Products Manufacturing

摘　　要：分析了存储器芯片自动测试设备的一般构架、存储器件MCP最终测试的需求和特点,研究了最终测试成本的影响因素,提出了存储器件最终测试解决方案应达到的标准,进而分析了VERSATEST应用于MCP最终测试的构架优势,并深入研究了突破性关键接口技术——可编程接口矩阵(PIM)。实验表明,该解决方案可实现有效的MCP最终测试、减少测试时间、提高测试并行度,从而降低测试成本。By investigating the common architecture of Automatic Test Equipment （ATE） for memory devices and the Final Test challenges of memory based Multi-Chip Package （MCP） devices, and by analyzing the factors affecting HVM testing cost, certain criteria for selecting Final Test Solution are drawn. The benefit of VERSATEST architecture as a solution for MCP Final Test is further analyzed, and the key technology solution of Programmable Interface Matrix （PIM） is also investigated. As the experiment results show, the solution can realize the effective Final Test of MCE decrease test time and increase the parallelism, and thus reduce the cost of test.

关 键 词：多芯片封装 自动测试设备 最终测试 

分 类 号：TN407[电子电信—微电子学与固体电子学]