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作 者:田建柏[1] 熊兵[1] 王健[1] 蔡鹏飞[1] 孙长征[1] 罗毅[1]
机构地区:[1]清华大学电子工程系集成光电子学国家重点实验室,北京100084
出 处:《红外与毫米波学报》2006年第2期105-108,共4页Journal of Infrared and Millimeter Waves
基 金:国家自然科学基金(60244001;60223001和60290084);"863"高技术计划(2001AA312190和2002AA31119Z);"973"重点国家基础研究(G2000-03-6601)资助项目
摘 要:设计制作了面向40Gb/s电吸收调制器(EAM)的高速微波过渡热沉,并进行了EAM管芯级封装测试的验证.这种基于氧化铝(Al2O3)的热沉采用共面波导(CPW)传输线以实现低损耗微波传送,以及Ta2N薄膜电阻用于EAM的阻抗匹配,采用Ti/Cu/Ni/Au金属材料作为CPW传输线电极材料,从而保证CPW传输线与Ta2N电阻材料之间良好的电接触,使热沉的典型反射系数在0—40GHz范围内均达到优于-21dB的水平.作为验证,采用该种热沉用于高速EAM的管芯级封装,测试得到小信号调制响应带宽超过40GHz.A high-speed submount was designed and fabricated for 40 Gb/s electroabsorption modulators (EAMs), and characterized in the chip-level packaging and testing of an EAM device. The Al2O3-based submount contains a coplanar waveguide (CPW) for microwave signal feeding and a Ta2 N thin-film resistor for impedance matching of EA modulator. Ti/ Cu/Ni/Au metal is introduced as the CPW electrode material, and good contact with Ta2 N thin-film is guaranteed accordingly. Therefore, the typical reflection coefficient of the submount is reduced to be lower than - 21 dB up to 40 GHz. As a demonstration, a high-speed EA modulator was packaged by using the high-speed submount, and the small-signal modulation bandwidth was measured to be over 40 GHz.
关 键 词:高速热沉 电吸收调制器 共面波导传输线 薄膜电阻 阻抗匹配
分 类 号:TN36[电子电信—物理电子学] TN81
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