AlSiC电子封装材料及构件研究进展  

Advances in Research on Aluminum Silicon Carbide Electronic Packaging Composites and Components

作　　者：熊德赣[1] 程辉[1] 刘希从[1] 赵恂[1] 鲍小恒[1] 杨盛良[1] 堵永国[1] 

机构地区：[1]长沙国防科技大学航天与材料工程学院,410073

出　　处：《材料导报》2006年第3期111-115,共5页Materials Reports

摘　　要：AlSiC电子封装材料及构件具有高热导率、低膨胀系数和低密度等优异性能,使封装结构具有功率密度高、芯片寿命长、可靠性高和质量轻等特点,应用范围从功率电子封装到高频电子封装。综述了国内外制备AlSiC电子封装材料及构件所涉及的预制件成形、液相浸渗铸造、力学性能、气密性、机械加工、表面处理和构件连接等方面的研究进展。Aluminum silicon carbide electronic packaging materials and components are a variety of outstand ing properties for use in high performance packing, such as high thermal conductivity, low coefficient of thermal expan sion and low density. The resulting advantages include higher possible powder density, a long chip lifetime, higher relia bility and substantial weight savings compared to alternative packaging concepts. The application area ranges from powder electronics packaging to high frequency packaging. Preform erties, hermeticity, machining, surface treatment and jointing of aging materials and components are reviewed. fabrication, liquid metal infiltration, mechanical propcomponent of aluminum silicon carbide electronic pack

关 键 词：AlSiC电子封装材料 预制件 液相浸渗 机械加工 表面处理 构件连接 

分 类 号：TN305.94[电子电信—物理电子学] TP311.5[自动化与计算机技术—计算机软件与理论]