微电子封装无铅钎焊的可靠性研究  

Lead-Free Trend In Microelectronics Packaging & the Reliability of Solder Interconnection Joint

作　　者：梁凯[1] 姚高尚[1] 简虎[1] 熊腊森[1] 

机构地区：[1]华中科技大学材料学院,武汉430074

出　　处：《电子质量》2006年第4期28-31,共4页Electronics Quality

摘　　要：本文阐述了微电子封装采用无铅钎料的必要性,概述了无钎铅料的研究现状,最后着重分析讨论了微电子封装无铅钎焊的可靠性问题。No doubt, we are stepping into the lead-free new era .In this paper, the reasons and importance of lead-free solder material applied to mlcroelectronics packaging industry is explained; current research and development of lead-free solder material are concerned too; and the reliability of lead-free solder in microelectronics packaging Industry Is focused on.

关 键 词：无铅钎焊 微电子封装 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]