基于最小能量原理的LCCC焊点三维形态建模与预测  

Modeling and predicting of LCCC solder Joint 3-D shape by minimum potential energy theory

作　　者：阎德劲[1] 周德俭[1] 黄春跃[1] 吴兆华[1] 

机构地区：[1]桂林电子工业学院机电与交通工程系,广西桂林541004

出　　处：《桂林工学院学报》2006年第1期107-110,共4页Journal of Guilin University of Technology

基　　金：广西自然科学基金资助项目(02336060)

摘　　要：基于最小能量原理和焊点形态理论,建立了LCCC器件焊点三维形态预测模型.运用该模型对焊点钎料桥连过程进行了数值模拟.结果表明,钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响.在间隙高度为0.03 mm、宽度为0.70 mm、焊盘长度为1.90 mm的条件下,避免焊点产生桥连的临界钎料体积为0.725 mm3.The 3-D evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory. The process of LCCC solder joint bridge is simulated numerically. The results show that the volume of solder, interstice height, and size of bonding pad have a remarkable effect on the 3-D shapes of LCCC solder joint. When the interstice height is 0.03 mm, the width and length of bonding pad is 0.70 and 1.90 mm respectively. The volume of solder is less than 0.725 mm^3 to avoid formation of the solder joint bridge.

关 键 词：SMT 焊点形态 最小能量原理 钎料桥连 

分 类 号：TG40[金属学及工艺—焊接]