多芯片基板高频信号传输特性分析  

Analysis of Transfer Characteristic for High Frequency Signals in MCM Substrate

作　　者：丁俊民[1] 周燕[2] 孙海燕[2] 

机构地区：[1]南通大学 [2]东南大学

出　　处：《南通大学学报（自然科学版）》2006年第3期48-51,共4页Journal of Nantong University(Natural Science Edition)　

基　　金：江苏省高技术项目(BG2005022);南通大学自然科学基金资助项目(05Z114)

摘　　要：基于陶瓷板材,完成了一种多芯片基板的设计,讨论了基板上高频信号线的传输线效应、互连延迟引起的时序问题以及串扰等信号完整性问题.根据二端口等效电路理论,提出了建立基板高频互连线Spice模型的方法,为芯片-封装协同设计提供了依据.Based on ceramic material, a kind of MCM substrate is designed. The problems about signal integrity such as the transmission line effect of high-frequency signal lines, the time sequence caused by interconnection and cross talk are discussed. Finally, a method of building the Spice model with high-frequency interconnection line in the substrate is proposed, thus providing a foundation for coordination design of chip package.

关 键 词：互连线 多芯片基板 先进封装 建模 

分 类 号：TN45[电子电信—微电子学与固体电子学]