低温共烧基板材料研究进展  

Development of Low Temperature Cofired Ceramics Material

作　　者：杨娟[1] 堵永国[1] 张为军[1] 周文渊[1] 

机构地区：[1]国防科技大学航天与材料工程学院,长沙410073

出　　处：《材料导报》2006年第10期12-16,共5页Materials Reports

基　　金：国家高科技研究发展计划(863计划)资助课题(2004AA32G090)

摘　　要：LTCC是现代微电子封装中的重要组成部分,因性能优良而广泛应用于高速、高频系统。LTCC基板材料的性能决定封装的质量,材料的研究在LTCC的进展中发挥了重要作用。LTCC基板材料可分为两大类:玻璃/陶瓷和微晶玻璃。概述了各类基板材料的组成、性能和应用方面的情况,并介绍了各类材料研究的进展,指出了基板材料未来的发展方向。LTCC is the important composite of modern microelectronic packaging. The perfect properties make it useful widely in the high-speed and high frequency system. The final quality of packaging is decided by the substrate material. Therefore,study on the material effects the history of the LTCC. The material can be divided into two kinds; glass/ceramic and glass-ceramics. The two kinds of materials are introduced with their properties, composites and appli cations. At the same time, the development of the study about LTCC and the orientation are also mentioned.

关 键 词：LTCC 基板 微晶玻璃 玻璃/陶瓷 

分 类 号：TN305[电子电信—物理电子学]