PVD溅射技术在MEMS器件制作中的应用  

PVD Sputtering Technology and It's Application on MEMS

作　　者：王雄[1] 吴学忠[1] 

机构地区：[1]国防科技大学机电工程与自动化学院,长沙410073

出　　处：《传感技术学报》2006年第05A期1434-1436,1440,共4页Chinese Journal of Sensors and Actuators

基　　金：国家自然基金资助项目(50375154)

摘　　要：简单介绍了PVD溅射系统和溅射原理.实验分析了PVD溅射技术在微晶玻璃基片溅射沉积Cu膜时,沉积速率随相关工艺参数变化而变化的几点规律.给出了用PVD溅射技术沉积的Cu膜的表面形貌(AFM)图和显微镜照片.A PVD sputtering system and its principle is shown. Some Cu films were sputtered by this sputtering system. Based on these experiments, some common relationships are educed between deposition rate and some different factors. At the same time, a AFM picture of Cu film is shown.

关 键 词：微机电系统 PVD溅射 薄膜沉积速率 原子力显微镜 

分 类 号：TB43[一般工业技术]