无背板生长工艺微电铸均匀性的实验研究  

Experimental Study on the Uniformity of Micro-Electroforming Based on no Backing Process

作　　者：刘海军[1] 杜立群[1] 秦江[2] 朱神渺[2] 

机构地区：[1]大连理工大学教育部精密与特种加工技术重点实验室,辽宁大连116023 [2]大连理工大学辽宁省微纳米技术及系统重点实验室,辽宁大连116023

出　　处：《传感技术学报》2006年第05A期1481-1483,1487,共4页Chinese Journal of Sensors and Actuators

基　　金：国家863MEMS重大专项资助(2004AA404260)

摘　　要：针对基于无背板生长工艺的微电铸模具高度不均匀问题,本文首次采用两种不同的周期换向电流进行了实验研究.两种周期换向电流分别是正负脉冲换向电流和正向脉冲负向连续的换向电流,实验采用在大量正脉冲电流微电铸实验基础上总结出来的工艺参数.实验结果表明,由于负向电流腐蚀铸层表面的微观突起,脉冲间断时间消除微电铸阴极表面的浓差极化,正负脉冲电流获得了较好的微电铸均匀性.An experimental study was carried out to improve the uniformity of micro-electroforming based on no backing process. Two different periodical reversal currents, which are firstly used in electroforming research, are pulse reverse current and periodical reversal current without off-times in the negative current, respectively. The parameters applied in these experiments are summarized from lots of micro-electroforming using pulse current. Because the negative current could erode the tips in the electroforming surface and concentration polarization was eliminated during the off-times, better uniformity was obtained in the micro-electroforming using pulse reverse current.

关 键 词：无背板生长工艺 微电铸 周期换向电流 均匀性 

分 类 号：TQ153.4[化学工程—电化学工业]