MEMS器件热致封装效应的解析建模研究  

Analytical Modeling on Thermally Induced Packaging Effect of MEMS Devices

作　　者：宋竞[1] 黄庆安[1] 唐洁影[1] 

机构地区：[1]东南大学MEMS教育部重点实验室,南京210096

出　　处：《传感技术学报》2006年第05A期1613-1616,共4页Chinese Journal of Sensors and Actuators

摘　　要：由封装结构热失配引入的结构变形和应力将对MEMS器件性能产生显著影响,即热致封装效应.基于单元库法思想构建了封装后MEMS器件的解析模型.新建锚区、芯片、封装基板等标准单元,利用节点分析法描述了各结构单元间的热弹性耦合行为,以此作为封装效应评估的基础.利用该模型计算了热致封装效应对常规芯片粘接封装的双端固支梁器件主要性能参数的影响.Results from either experimental or numerical studies have already validated thermally-induced package effects on the performance and reliability of MEMS systems. But the theoretical descriptions for these effects are still lacked. A theoretical joint model for the whole packaged MEMS system is established based on the Cell Library Concept and the Nodal Analysis Method to enable the package-level simulations for the designers. Cases of conventional package-device systems are studied to demonstrate the application of this modeling method, and the results agree well with the FEM calculations. The challenges and suggestions for the design of package-level MEMS systems are finally discussed.

关 键 词：MEMS 热致封装效应 单元库法 节点分析法 

分 类 号：TN402[电子电信—微电子学与固体电子学] TN405