电子封装用无铅焊料的最新进展  

Recent Development of Lead-Free Solder in Electronic Packaging

作　　者：黄卓[1] 张力平 陈群星 田民波[1] 

机构地区：[1]清华大学材料科学与工程系,北京100084 [2]振华亚太高新电子材料有限公司,贵州贵阳550018

出　　处：《半导体技术》2006年第11期815-818,共4页Semiconductor Technology

基　　金：国家"863"计划引导项目(2002AA001013)

摘　　要：随着WEEE/RoHS法令的颁布,电子封装行业对于无铅焊接提出了更高的要求。根据国际上对无铅焊料的最新研究进展提出了无铅焊料“三大候选”的概念。总结了目前无铅焊料尚存的三大主要弱点,并对国际上推荐使用的几种无铅焊料的优缺点进行了概述。Along with the issue of WEEE/RoHS, electronic packaging industry raised the further requirement for lead-free jointing. The three substitutes of lead-free solder were brought forward according to the recent research. Three main weaknesses about the lead-free solder being used nowadays were summarized, and a summarization of the advantages and disadvantages about the international recommended lead-free solders were made as well.

关 键 词：无铅焊料 候选焊料 熔点 稳定性 

分 类 号：TN305.94[电子电信—物理电子学]