微量元素对焊料特性的影响  

Influence of Microelements on Properties of Sn-20Bi Solder

作　　者：李元山[1] 雷晓娟[2] 陈振华[2] 

机构地区：[1]国防科技大学,湖南长沙410073 [2]湖南大学,湖南长沙410082

出　　处：《电子工艺技术》2006年第6期326-328,332,共4页Electronics Process Technology

基　　金：装备预研项目(项目编号:51416060204KG0172)

摘　　要：在Sn-20B i焊料中添加微量Ag、In、Ga和Sb,观察焊料的熔化特性和显微组织的变化。结果表明当Ag的质量分数为0.7%、In为0.1%、Ga为0.5%时焊料的熔点都分别有所降低,B i的偏析明显减小;Sb不宜作为单独的第三组元加入,但与Ag、In、Ga一起加入时Sb能起到很好的固溶强化且有抑制Sn的相变的作用。通过最佳配比制成的Sn-B i-X焊料,其熔点与Sn-37Pb接近,而且已不存在B i的偏析,接近于实用。Adding microelements Ag, In,Ga and Sb into Sn- 20Bi solder,the change of melting properties and microstructures of the solder were observed. The experiment result showed that when the content of Ag was 0.7% ,In was 0.1% or Ga was 0.5% the melting points of the solder reduced respectively and the segregation of Bi obviously decreased. Sb was not suitable added solely but when it was added together with Ag,In and Ga,it can produce a good effect on reinforcement of solid solution,furthermore it can restrain the phase change of Sn. The Sn - Bi -X solder with the best composit;ons of Ag, In,Ga and Sb has a near melting point to Sn - 37Pb. The solder is close to practicality without segregation of Bi.

关 键 词：Sn—Bi 无铅焊料 偏析 微观结构 固溶强化 

分 类 号：TN604[电子电信—电路与系统]