热超声倒装键合过程中的非线性动力学行为  

Nonlinear Dynamical Behaviors in Flip-Chip Thermosonic Bonding

作　　者：韩雷[1] 钟掘 

机构地区：[1]中南大学机电学院,长沙410083

出　　处：《Journal of Semiconductors》2006年第11期2056-2063,共8页半导体学报（英文版）

基　　金：国家自然科学基金(批准号:50575230;50429501;50390064);国家重点基础研究发展规划(批准号:2003CB716202)资助项目~~

摘　　要：在作为微器件电气互连主要手段的热超声键合工艺中,微细键合区域内金属变形/变性/互连所需的能量,来自于超声波功率源通过换能系统所施加的微幅压剪动载.对热超声倒装键合过程的研究说明,PZT换能系统在热超声倒装键合工艺过程中的非线性动力学行为,如换能系统启动后的初值敏感性和不确定性,键合工具与换能杆之间的不稳定动力耦合,倒装芯片运动的奇异相轨线等,是深入研究键合机理以及提高工艺可靠性的重要关键.Dynamical characteristics of transducer systems are the key to the basic understanding of metal interconnection and reliable fine pitch flip-chip bonding. Systematic experimental analysis clearly shows that rich phenomena and effects such as a Duffing resonator,dynamical coupling between the transducer and bonding tool,and strange phase portraits of die movernent may be explained by the nonlinear features of a real world transducer system. It is possible to explore their mechanisms and effects on bonding quality by identifying and decoding them from experimental data.

关 键 词：热超声键合 PZT换能系统 非线性动力学 倒装芯片 封装互连 

分 类 号：TN405[电子电信—微电子学与固体电子学]