一类新型高导热环氧模塑料的制备  

Preparation of New Type Epoxy Molding Compounds with High Thermal Conductivity

作　　者：韩艳春[1] 傅仁利[1] 何洪[1] 沈源[1] 宋秀峰[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016

出　　处：《电子元件与材料》2006年第12期34-36,40,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(50472019)

摘　　要：采用Si3N4陶瓷作填料,制备了一类新型高导热的环氧模塑料,研究了Si3N4的含量、分布及其形态对复合材料的导热性能及介电性能的影响。结果表明:随着Si3N4粉末体积填充量的增加,复合材料的热导率显著提高,当填充量体积分数为60%时,复合材料的热导率达到2.3W/(m·K),其介电常数随体积填充量的增加亦有所增加,但仍然维持在低水平。采用Agari模型进行理论计算的结果表明,该体系导热性能的提高与Si3N4填料之间热传导网络的形成有关。A new type of epoxy molding compounds with high thermal conductivity was obtained using Si3N4 powder as filler. The influence of the fraction, distribution and configuration of the Si3N4 powder on its thermal property and dielectric property were investigated. The results show that the thermal conductivity of the composite improves obviously with the filler content increasing. The composites show a highest thermal conductivity of 2.3 W/（m· K） when the volume fraction of Si3N4 reaches 60 %. The dielectric constant also increases with the filler content increasing, but it remains at a relative low lever. The results of simulation with Agari theory model show that the improvement of EMC＇s thermal conductivity related to the shape of thermal network of Si3N4 fillers.

关 键 词：复合材料 环氧模塑料 氮化硅 导热性能 介电性能 理论模型 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]