SnAgCu无铅钎料液体在非润湿线上的去润湿现象  

DEWETTING OF SnAgCu LEAD-FREE SOLDER LIQUID ON NON-WETTING LINE

作　　者：王福学[1] 张磊[2] 史春元[1] 尚建库[2] 

机构地区：[1]大连交通大学材料科学与工程学院,大连116028 [2]中国科学院金属研究所沈阳材料科学国家(联合)实验室,沈阳110016

出　　处：《金属学报》2006年第12期1298-1302,共5页Acta Metallurgica Sinica

基　　金：国家自然科学基金项目50501022;国家重点基础研究发展计划项目2004CB619306资助~~

摘　　要：在Cu基底上制备了宽度为200μm的非润湿线, SnAgCu无铅焊膏回流过程中形成的钎料液体在非润湿线上发生去润湿．对印刷不同厚度锡膏样品回流过程中液体形态的原位观察发现,焊膏厚度由950μm减小时,回流液体球冠沿非润湿线分离的长度增加,当焊膏厚度达到350μm时,液体被彻底分割为两部分．通过一个简单模型并运用界面能最小化分析,给出了非润湿线宽度与液体临界高度之间的关系．理论分析与实验结果基本一致,间接反映了微电子钎焊连接中发生桥接的本质．Specific non-wetting lines with a definite width of 200 μm were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line was observed and recorded in situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreased from 950 μm, the separation length of the liquid along the non-wetting line was elongated gradually. For the solder paste with a height of 350 μm, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experiment agreed with the critical height for a 200 μm non-wetting line calculated accordingly. These results gave a clear hint on the origin of solder bridging.

关 键 词：无铅钎料 桥接 润湿 去润湿 

分 类 号：TG113[金属学及工艺—物理冶金]