溅射沉积Ni-Mn-Ga薄膜的研究进展  

The Development of Sputtering Deposited Ni-Mn-Ga Thin Films

作　　者：孙景文[1] 李长生[1] 李俊茂[1] 姚固文[1] 姜春华[1] 

机构地区：[1]江苏大学机械工程学院,镇江212013

出　　处：《材料导报》2006年第F11期326-329,共4页Materials Reports

摘　　要：以Ni-Mn-Ga为主要代表的铁磁形状记忆合金(FSMAs)不但具有传统形状记忆合金受温度控制的热弹性形状记忆效应,而且具有受磁场控制的铁磁形状记忆效应。微机电系统(MEMS)的应用要求Ni-Mn-Ga合金必须制备成薄膜的形式。对溅射沉积Ni-Mn-Ga薄膜的制备工艺进行了回顾与总结,对薄膜的各种性能特征和影响因素进行了详细的叙述,最后介绍了溅射沉积Ni-Mn-Ga薄膜的应用状况和应用趋势。The ferromagnetic shape memory alloys（FSMAs）such as Ni-Mn-Ga alloys is a new type of intelligent material that has both conventional thermal shape memory effect and magnetic shape memory effect which is due to a magnetic field-induced rearrangement of martensitic variants. In order to be applied in the MEMS field, Ni-Mn Ga alloys have to be in the form of thin films. In this text, the magnetron sputtering technologies of Ni-Mn-Ga thin films are introduced and then the relationship between the film performance and the corresponding affection factors are explained. At last the applications and future trends are introduced.

关 键 词：磁控溅射 Ni—Mn-Ga薄膜 铁磁形状记忆合金 MEMS 

分 类 号：TB381[一般工业技术—材料科学与工程]