A breakthrough in core IC equipment R&D and industrialization  

出　　处：《Bulletin of the Chinese Academy of Sciences》2006年第4期247-247,共1页中国科学院院刊（英文版）

摘　　要：A major special project of integrated circuit （IC） manufacturing equipment of the National High-tech Research and Development Program, dubbed ＂863＂ Program, passed the acceptance check jointly organized by the Ministry of Science and Technology and Beijing Municipality on Sept. 28 in Beijing.

关 键 词：集成电路制造设备 等离子体蚀刻 离子注入 核心装备 研究开发 检查 验收 

分 类 号：TN402[电子电信—微电子学与固体电子学]