自组装技术在MEMS中的应用  

Applications of Self-assembly Technology in MEMS

作　　者：李明[1] 唐洁影[1] 

机构地区：[1]东南大学MEMS教育部重点实验室,江苏南京210096

出　　处：《电子工业专用设备》2007年第1期1-5,36,共6页Equipment for Electronic Products Manufacturing

摘　　要：起源于生物化学领域的自组装技术正被广泛地应用到了化学、材料、生物、电子、机械等不同的学科中。在MEMS和NEMS中,自组装作为一种新型的“自下而上”的微(纳)结构制备和装配技术而得到积极的关注,并显示出良好的应用前景。在阐述自组装技术发展的基础上,介绍了该技术在MEMS中的典型应用,讨论一些待解决的关键问题,最后展望了自组装技术的发展趋势。Self-assembly （SA） phenomenon was first observed in micro bio-chemical field where micro cells organize themselves in a specified form spontaneously. Since then it has been widely used in different fields to generate new functional materials, devices and structures. As a ＂bottom-up＂ scheme, this approach can be potentially used to fabricate new devices and structures other than conventional technologies in MEMS and NEMS area. This paper describes the technological evolution of SA technology and reviews typical SA methods by means of surface tension, capillary force, magnetic force, electrostatic force and stress, etc. The promising application in MEMS in the future is also discussed.

关 键 词：MEMS NEMS 自组装 微装配 

分 类 号：TP271.4[自动化与计算机技术—检测技术与自动化装置]