半导体硅片键合:MEMS制造工序中的成熟技术(英文)  

Wafer Bonding:a Mature Technology for MEMS Manufacturing

作　　者：V.Dragoi P.Lindner H.Kirchberger P.Kettner 

机构地区：[1]EV Group,DI Erich Thallner Strasse 1,A-4782 St.Florian /Inn,Austria [2]EV Group,DI Erich Thallner Strasse 1,A-4782 St.Florian /Inn Austria

出　　处：《电子工业专用设备》2007年第1期31-36,共6页Equipment for Electronic Products Manufacturing

摘　　要：新型MEMS应用领域的发展为现有的制造技术带来了很大的挑战,并促使了满足新加工要求的制造能力的发展。根据目前MEMS制造中普遍采用的不同的晶圆键合方法及其主要工艺参数要求,开发了一种新型的晶圆键合技术。The new MEMS applications raised important challenges to the existing manufacturing technologies and lead to the development of new processes able to fulfill the new demands. Based on the different wafer bonding approaches that are currently used in MEMS manufacturing, and their main parameters of the wafer bonding processes used nowadays in MEMS manufacturing, a new type of wafer bonding technique was developed in order to accommodate these specific requirements.

关 键 词：硅片键合 微机电系统 制造工艺 

分 类 号：TP271.4[自动化与计算机技术—检测技术与自动化装置]