一种MEMS薄膜材料的力学性能测试方法  

Method for measuring mechanical properties of MEMS thin film materials

作　　者：李雪萍[1] 丁桂甫[1] 安藤妙子[2] 式田光宏[2] 佐藤一雄[2] 

机构地区：[1]上海交通大学微纳科学技术研究院薄膜与微细技术教育部重点实验室微米/纳米加工技术国家级重点实验室,上海200030 [2]名古屋大学微纳系统工程系

出　　处：《传感器与微系统》2007年第2期85-87,91,共4页Transducer and Microsystem Technologies

基　　金：中国博士后科学基金资助项目(2005038145)

摘　　要：介绍了一种用于MEMS薄膜材料力学特性测试的单轴拉伸试验方法。其特点是微小试件两端固定,且与加载机构集成在基片上,从而可减少操作工作量,提高对准精度。整个机构以微细加工方法制成,硅类试件以干法蚀刻成型,金属类试件以电镀方法成型,其余加载机构以湿法刻蚀制成。试验表明:使用此机构可以简单且高精度地对薄膜试件进行拉伸试验,获得多项力学性能参数,从而为MEMS器件设计和分析提供可靠的理论基础。A uniaxial tensile test method for measuring mechanical properties of MEMS thin film materials is presented. Its characterizations are the both-ends fixed specimen and the integrated loading mechanism on the substrate; therefore it can eliminate the troublesomeness of manipulating and aligning the specimen. The on-chip device is microfabricated by wet etching, and the silicon specimen is shaped by dry etching; yet the metal specimen is shaped by electroplating. The experiments show that using this method can conduct simply, precisely tensile test on thin film specimens and obtain their mechanical properties. It can provide reliable parameters for designing and analyzing MEMS devices.

关 键 词：微机电系统 力学性能 薄膜 拉伸试验 

分 类 号：TG115.5[金属学及工艺—物理冶金]