氧化铝陶瓷基板化学镀铜金属化及镀层结构  

Metallization and structure of copper layer on Al_(2)O_(3)ceramic by electroless copper plating

作　　者：宋秀峰[1] 傅仁利[1] 何洪[1] 沈源[1] 韩艳春[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,江苏南京210016

出　　处：《电子元件与材料》2007年第2期40-42,共3页Electronic Components And Materials

基　　金：南京航空航天大学科研启动资金资助项目(批准号:S0466-061)

摘　　要：通过化学镀铜在氧化铝陶瓷基板表面实现了金属化,采用SEM研究了镀铜层表面微观形貌以及热处理的影响,检测分析了金属化镀层附着力。结果表明:通过控制镀液中铜离子浓度以及铜沉积速率,在基板表面可形成均匀致密的铜金属化层;热处理后进一步提高镀层致密化和导电性,其方阻由3.6 mΩ/□降为2.3 mΩ/□。划痕法测试表明镀铜层与氧化铝陶瓷基板结合紧密无起翘,可以满足敷铜基板的要求。Surface metallization on alumina ceramic was realized by electroless copper plating. Microstructure of the metallized copper layer before and after heat treatment was studied by SEM. The adhesion strength of the metallic copper layer was evaluated. The results indicate that compact metallic layer can be obtained on the surface of alumina by controlling the concentration of copper ions in plating bath and deposition rate. After heat treatment, the metallic copper layer is more compact, and the electronic property are improved, electric resistance are reduced from 3.6mΩ/□ to 2.3mΩ/□. Coalescent to the alumina substrate is compact and free flexure. The adhesion strength is good enough for use in electrocircuit.

关 键 词：电子技术 表面金属化 化学镀铜 Al_(2)O_(3)陶瓷 表面形貌 

分 类 号：TQ153[化学工程—电化学工业]