Sn-20Bi-X无铅焊料的显微组织和物理性能  

Microstructure and Physical Properties of Sn-20Bi-X Lead-Free Solders

作　　者：杨石强[1] 雷晓娟[1] 李元山[2] 陈振华[1] 

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082 [2]国防科技大学计算机学院,湖南长沙410073

出　　处：《湖南大学学报（自然科学版）》2007年第3期49-52,共4页Journal of Hunan University:Natural Sciences

基　　金：装备预研项目(51416060204KG0172)

摘　　要：采用合金化的方法,以Sn-20Bi合金为基础,研究了添加第三组元Ag,ln,Ga或Sb对Sn-Bi合金微观结构、物理性能的影响．结果表明:在Sn-20Bi中加入0．7%的Ag,0．5%的Ga,0．1%的In可使脆硬相Bi细小分散,偏析减少,合金熔化温度降低,获得较好的组织和性能;Sb作为单独的第三组元加入,使Sn-Bi-Sb合金中Bi的偏析较多,硬度有所上升．Sn-20Bi lead-free solders were studied in alloying method. Adding alloy element Ag, In, Ga or Sb into Sn - 20Bi, the influences of the change of Ag, In, Ga or Sb contents on their microstructure and physical properties were investigated. The results showed that, when the content of Ag was 0.7 96, Ga was 0.5 96, or In was 0. 1%, the melting points of the solder reduced correspondingly and the segregation of Bi decreased, and the microstructure and physical properties were better. Sb was not suitably added solely, and the microstructure of Sn - Bi - Sb solder were a little worse than that of Sb- free alloys, but the hardness increased.

关 键 词：焊料 SN 偏析 物理性能 显微组织 

分 类 号：TG425[金属学及工艺—焊接]