Invar合金电子封装零件的制备及性能  

Preparation and properties of Invar alloy parts for electronic package

作　　者：段柏华[1] 曲选辉[1] 林冰涛[1] 秦明礼[1] 程彤[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《电子元件与材料》2007年第4期15-18,共4页Electronic Components And Materials

基　　金：国家"863"计划资助项目(2001AA337050)

摘　　要：研究了粉末注射成型技术生产Invar合金电子封装零件的工艺.设计一种新型蜡基多聚合物组元粘结剂,其组成：PW,PEG,LDPE,PP,SA的质量分数分别为50 %,20 %,15 %,10 %,5 %.并依其差热分析结果制定了合理的脱脂工艺.在1 350 ℃氢气烧结时,可制备出性能优良的PIM Invar合金电子封装零件,其致密度、抗拉强度、30～300 ℃温度内的平均热膨胀系数α30～300 ℃分别为98.5 %、420 Mpa、4.5×10-6℃-1,其漏气率小于1.4×10-9 Pa·m3·s-1.The electronic package parts of Invar alloy were prepared by powder injection molding. A new type wax-based polymer binder was designed, which was composed of 50 % PW, 20 % PEG, 15 % LDPE, 10 % PP and 5 % SA （mass fraction） Based on the thermal analysis of the binder, a suitable debinding process was set up. After sintered at 1 350 ℃ under H2 atmosphere, the electronic package parts of Invar alloy with high properties are obtained by powder injection molding, which the relative density, tensile strength, the average thermal expansion coefficient over the range of 30-300℃ and the leakage rate are 98,5 %, 420 MPa, 4.5×10^-6℃^-1 and lower than 1.4xl0-gPa ~ m3 ~ s-I respectively.

关 键 词：金属材料 粉末冶金 粉末注射成型 Invar合金 电子封装材料 粘结剂 

分 类 号：TF125.2[冶金工程—粉末冶金]