复合陶瓷颗粒/环氧模塑料的制备与性能  

The Preparation and Properties of Epoxy Molding Compounds Filled with Multiple Ceramic Particles

作　　者：韩艳春[1] 傅仁利[1] 何洪[1] 沈源[1] 宋秀峰[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《电子与封装》2007年第1期4-7,13,共5页Electronics & Packaging

基　　金：国家自然科学基金(50472019)

摘　　要：选用SiO_2、Al_2O_3、Si_3N_4三种陶瓷颗粒的复合填充环氧模塑料(EMC),研究了不同填料种类、含量对EMC导热系数、热膨胀系数(CTE)、介电常数等性能的影响随着填料百分含量的增加,EMC的热导率、介电常数也随之增加,而其热膨胀系数显著下降相同体积百分含量下,Al_2O_3、Si_3N_4复合体系EMC热导率和介电常数高于SiO_2、Si_3N_4复合体系,而其热膨胀系数比后者低。百分含量为60%时,前者热导率达到2．254 W(m·K)^(-1)、后者达到2．04w(m·K)^(-1)。百分含量为65%时,其CTE分别为1．493×10^(-5)K^(-1)、1．643×10^(-5)K^(-1)。A kind of epoxy molding compounds （ EMC ） filled with silicon dioxide, alumina and silicon nitride powder was obtained .The influence of the species and fraction of the filler on its thermal conductivity, coefficient of thermal expansion （ CTE ） and dielectric constant were investigated respectively. The thermal conductivity and dielectric constant of EMC improves obviously with the filler content increasing. But CTE descends sharply. At the same volume fraction, the thermal conductivity and dielectric constant of EMC filled with alumina and silicon nitride are higher than that＇s of the other one. But its CTE is lower than the latter. The thermal conductivity of the former reaches 2.254 W （ m·K ）^ -1 and the latter reaches 2.04 W （ m·K ）^-1 at 60% volume fraction. And the CTE reaches 1.493×10^-5K^-1, 1.643×10^-5K^-1 respectively at 65% volume fraction. At the same time ,the dielectric constant of this EMC can remains at a relative low lever.

关 键 词：环氧模塑料 复合陶瓷 热性能 电性能 

分 类 号：TN305.94[电子电信—物理电子学]