球栅阵列器件焊接合格率预测及缺陷分析  

Prediction of BGA solder yield and analysis of solder defects

作　　者：魏鹤琳[1] 王奎升[1] 

机构地区：[1]北京化工大学机电工程学院,北京100029

出　　处：《电子元件与材料》2007年第5期62-65,共4页Electronic Components And Materials

摘　　要：应用数理统计结合工艺设计、制造工艺控制参数等因素及Surface Evolver软件仿真技术的方法,建立球栅阵列(BGA)器件焊接合格率的预测模型,运用该模型可以找出影响焊接合格率的制约因素。结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。By mathematical statistics based on the manufacturing process variations and variations of component and PCB, using the software of surface Evolver simulation, mode of BGA solder yield predictor was built. Using the mode and simulating the solder joint shapes, find the root cause of solder defects identify the relationship of designand process parameters, suggest design improvemet.

关 键 词：半导体技术 球栅阵列 焊接合格率 数理统计模型 焊接缺陷 焊点形态 

分 类 号：TG40[金属学及工艺—焊接]