系统级封装(SIP)技术及其应用前景  

Technology of System in Package and Its Applications Prospects

作　　者：韩庆福[1] 成立[1] 严雪萍[1] 张慧[1] 刘德林[1] 李俊[1] 徐志春[1] 

机构地区：[1]江苏大学电气与信息工程学院,江苏镇江212013

出　　处：《半导体技术》2007年第5期374-377,386,共5页Semiconductor Technology

基　　金：江苏省高校科研成果产业推进工程计划项目(JHZD06-42)

摘　　要：随着各种半导体新工艺与新材料水平的不断提高,先进的封装技术正在迅速地发展。本文综述了先进的系统级封装(SIP)技术的概念及其进展情况;并举例说明了它的应用情况,同时指出,SIP是IC产业链中知识、技术和方法相互交融渗透及综合应用的结晶。SIP封装集成能最大程度上优化系统性能、避免重复封装、缩短开发周期、降低成本和提高集成度,掌握这项新技术是进入主流封装领域之关键,有其广阔的发展前景。With higher standard of the new semiconductor processes and materials, the advanced package technology is developed rapidly. The concept and development of SIP （system in package） are described, its advantages are stated, its wide applications are illuminated. It is pointed out that SIP is the integrating result of knowledge, technique and process in IC industry. SIP can furthest optimize the system property, avoid the repeat of package, shorten the design period, cut the cost and raise integration. Mastering SIP is the key for entering the mainstream of package field, and the development prospects are great.

关 键 词：系统级封装 片上系统 技术优势 应用前景 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]