新型锡铋系无铅焊料的开发  

Exploitation of a New Style Tin-bismuth Series Lead-free Solder

作　　者：李元山[1] 雷晓娟[2] 陈振华[2] 杨石强[2] 

机构地区：[1]国防科技大学计算机学院,湖南长沙410073 [2]湖南大学材料科学与工程学院,湖南长沙410082

出　　处：《机械工程材料》2007年第5期24-26,65,共4页Materials For Mechanical Engineering

基　　金：武器装备预研基金(51416060204KG0172)

摘　　要：在锡铋系焊料中加入微量元素,通过快速冷却制成新的焊料,并对其组织与性能进行了研究。结果表明:添加微量元素具有抑制铋的偏析和形成粗大片状晶体的作用,并能提高锡铋焊料的固溶度,固溶强化提高了焊料的力学性能,使其抗剪强度接近锡铅共晶焊料;快速冷却能明显改善焊料的微观组织,降低熔点,使其焊接性能和力学性能接近或优于传统的锡铅共晶焊料。A new type of solder was fabricated by adding microelements into tin-bismuth series solder and then being rapid cooled. The microstructure and properties were investigated. Adding microelements restrain the segregation of bismuth, stopped bismuth forming into bulky crystal as strips, and increased the solid solubility of tin-bismuth solder. The solid solution strengthening improved the mechanical properties so that the shear strength came close to that of tin-lead eutectic solder. Rapid cooling apparently improved the microstructure of the solder, decreased its melting point and strengthened its soldering and mechanical properties which were close to those of tinlead eutectic solder.

关 键 词：锡铋系 无铅焊料 低熔点 偏析 快速冷却 

分 类 号：TG425[金属学及工艺—焊接]