焊球阵列封装及其返修工艺技术  

Ball Grid Array Package and Its Reprocess Technology

作　　者：成立[1] 杨建宁[1] 王振宇[1] 李加元[1] 李华乐[1] 贺星[1] 

机构地区：[1]江苏大学电气与信息工程学院,江苏镇江212013

出　　处：《半导体技术》2007年第6期535-538,共4页Semiconductor Technology

基　　金：江苏省高校自然科学研究基金项目(02KJB510005)

摘　　要：在简介各种焊球阵列(BGA)封装形式的基础上,归纳出BGA封装的技术优势,包括引脚结构、封装尺寸和封装密度等,并分析了BGA封装的返修工艺技术。分析结果表明,BGA封装进一步缩小了IC的封装尺寸,提高了高密度表面贴装技术水平,因而顺应了LSI和VLSI新品轻薄、短小及功能多样化的发展方向。Based on introducing some kinds of BGA package technology simply, the advantages of BGA package technology including the pin structure, package size and density were summarized, and the main points of reprocess technology were analyzed. The results of the above analysis have shown that BGA package shrinks the package size of IC chips and enhances the level of high density SMT. So BGA package technology conforms to the development of new products of LSI and VLSI that become lighter and thinner, shorter and smaller and have various functions.

关 键 词：BGA封装 返修工艺 表面贴装技术 芯片尺寸封装 回流焊 

分 类 号：TN305.94[电子电信—物理电子学] TN407