无铅技术对焊膏印刷的影响  

Non-lead Technology and Solder Paste Printing

作　　者：彭琛 顾菊芬 

出　　处：《丝网印刷》2007年第7期24-27,共4页Screen Printing

摘　　要：2006年7月1日限制铅使用的强制标准开始实施,传统的SMT生产必须向无铅化转变。随着无铅技术的发展,作为SMT生产主要工序之一的焊膏印刷也受到很多影响。以模版印刷为例,从三个方面展开无铅技术对焊膏印刷影响的讨论。又以Omnix 338T和Omnix 5002为例,研究分离速度、印刷速度及印刷压力对印刷效果的影响。With the forced execution of leadfree laws from July 1st, 2006, the traditional SMT production has to change into leadfree. As the development of leadfree, solder paste printing, one of the main process of SMT, is greatly effected. In this paper, we will take the stencil printing as an example to see the influence of leadfree on solder paste printing. Besides, we select Omnix 338T and Omnix 5002 to show the printing result of different separate speed, printing speed and printing pressure.

关 键 词：印刷 焊膏 模版 

分 类 号：TS85[轻工技术与工程]