含钨类金刚石薄膜的制备与性能研究  

Deposition of tungsten-doped DLC thin films and their properties

作　　者：牛孝昊[1] 罗庆洪[1] 杨会生[1] 陆永浩[1] 熊小涛[1] 王燕斌[1] 

机构地区：[1]北京科技大学材料物理与化学系,北京100083

出　　处：《真空》2007年第4期36-39,共4页Vacuum

摘　　要：为了满足制备较厚低摩擦系数类金刚石薄膜(DLC)耐磨镀层的实际需求,对在等离子增强化学气相沉积的类金刚石薄膜(W-DLC)中掺钨进行了系统研究。研究结果表明,类金刚石薄膜掺入钨,在较宽的工艺条件范围内,都可以沉积厚度超过5μm的薄膜而不发生剥落。适当控制工艺条件和膜中钨的含量可以提高薄膜的硬度,降低磨损率,且保持低的摩擦系数和较高的沉积速率。To meet the requirement for the diamond-like carbon thin films with low friction factor, the tungsten-doped diamond-like carbon （W-DLC） thin films prepared through PECVD were studied in depth. The results showed that the thickness of such thin films can be obtaind exceeding 5μm without peeling-off under relatively relaxed technological conditions. Their hardness can be improved with higher deposition rate and lower friction factor/wear rate kept on if the technological conditions and W content are controlled properly.

关 键 词：掺钨类金刚石薄膜 硬度 摩擦系数 等离子增强化学气相沉积 

分 类 号：TB43[一般工业技术]