MCM组件盒体与盖板气密封装倒置钎焊工艺方法  

An Upside-down Soldering Sealing Technique for MCM House Package

作　　者：解启林[1] 朱启政[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2007年第4期211-213,共3页Electronics Process Technology

摘　　要：提出了MCM组件盒体与盖板气密封装的一种倒置钎焊工艺方法。将盒体、焊片、盖板预装在一起,倒置在加热台上,盖板直接接触热台,借助夹具、合适的盒体结构形式以及适当的焊接工艺参数,能够实现盒体底部温度低于封盖焊料熔点30℃以上且实现气密封装,经测试,组件的电性能在封装前后没有明显变化,该方法操作简单、可靠,易于组件返修。Put forward a upside -down soldering technique for MCM house hermetic sealing with its lid. The MCM house was taken upside - down, with its lid and solder film loop grouped in advance,let the lid attach with the hot platform, then heated to finish soldering for hermetic sealing, clamps used and appropriate structure form design and optimized technical parameters to ensure the temperature on the bottom of MCM house was lower than the solder metal melting point by 30 ℃. After some testing, the MCM＇s electricity performance has no distinct change. This technique is very simple and credible, and it＇s relatively easy to remove the lid and to solder at repairing.

关 键 词：MCM 气密封装 倒置钎焊 

分 类 号：TN6[电子电信—电路与系统]