用于IC封装的光刻设备  

Photolithography Tools for IC Packaging

作　　者：童志义[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊065201

出　　处：《电子工业专用设备》2007年第8期6-10,20,共6页Equipment for Electronic Products Manufacturing

摘　　要：光刻是圆片级封装的一种最重要的工艺,无论是焊盘分布、焊凸形成、密封或其它新出现的需求,晶圆上精确的成像区域对每一种工序来讲是最重要的。评述了一些圆片级封装的光刻系统及为什么某些专门的设备能很好地适于应用,会是接近式光刻机、步进投影光刻机还是一些替代设备在未来的几年内来满足这种需求?我们将探索这种可能性。Lithography is an absolutely essential process for wafer-level packaging, whether for pad re- distribution, bumping, encapsulation or other emerging needs, precisely imaging areas on the wafer is essential for each process step. This article looks at several WLP lithography systems to see why certain specific approaches are working well. Will proximity aligners, wafer steppers, or some alternative tool dominate the process in years to come ？ We will explore the possibilities.

关 键 词：圆片级封装 焊凸形成 光刻设备 近式光刻机 

分 类 号：TN305.94[电子电信—物理电子学] TN305.7