一种高增益平坦度MMIC功放单片的调试方法  

Adjustment Method of High Gain Flatness PA MMIC

作　　者：朱旻[1] 梁晓新[1] 陈立强[1] 郝明丽[1] 张海英[1] 刘训春[1] 

机构地区：[1]中国科学院微电子研究所,北京100029

出　　处：《电子器件》2007年第4期1219-1222,共4页Chinese Journal of Electron Devices

基　　金：国家自然科学基金项目:"InP基HEMT复合沟道优化设计与模型建立"(60276021);国家重点基础研究规划资助项目:"新结构InP基HEMT器件和E/D型HEMT电路"(2002CB311901)

摘　　要：通过对自主流片的MMIC功率放大器单片的调试,总结出了一套行之有效的MMIC的调试方法.试验结果表明这种将电路仿真和实际测试相结合的方法,有效地减小由于模型和工艺误差带来的电路性能的降低,对于以后MMIC电路特别是功放的电路的调试工作起到了一定指导作用.By analyzing the method of debugging the power amplifier MMIC, a kind of effective adjustment method had been concluded. Experimental results show that this technique availably improved the circuit decreasing performance by using the device model that is not fully fit to the device and manufacture distinction which joined up the circuit simulation with the practice testing. This method will be useful to adjusting the power amplifier MMIC in the future.

关 键 词：功放 HBT MMIC 

分 类 号：TN407[电子电信—微电子学与固体电子学]