芯片封装设备焊头柔性铰直线缓冲结构的设计  

Design of Bonding Head of IC Encapsulation with Flexible Hinges Straight Buffer Mechanism

作　　者：刘吉安[1] 翁纪钊[1] 李克天[1] 刘建奇[1] 黄向修[1] 

机构地区：[1]广东工业大学,广州510006

出　　处：《包装工程》2007年第8期31-33,共3页Packaging Engineering

基　　金：国家自然科学基金(50475044);广东省自然科学基金项目(04300155);广州市科技项目(2004Z3-D9021)

摘　　要：焊头是IC芯片粘片机的关键部件,焊头上的吸嘴将晶圆上的芯片吸起,传送并压焊到引线框架上。在取芯片和焊芯片瞬间,吸嘴要对芯片施加压力。为了保证吸嘴和芯片快速接触时不会对芯片造成破坏性冲击,焊头机构除了应具有精密的结构和精确运动控制外,焊头本身也要有良好的缓冲功能和具有一定的刚度。提出一种焊头柔性铰直线缓冲结构,讨论柔性铰结构的原理和分析结果,通过实验验证该结构是合理可行的。Bonding head is the key part of the die-bonder, it picks up die in wafer, and transfers and bonds the die into lead frame. In the moment of picking and bonding, it exerts force against die. In order not to shatter the die during the quick contact, the bonding head must not only have exact structure and precise movement, it also must have good buffering function and rigidity. A kind of bonding head with flexible hinge straight -line buffer mechanism was put forward. The structure principle and experimental results were analyzed and discussed. It was proved that the structure is feasible.

关 键 词：封装 柔性 直线 缓冲 

分 类 号：TB486[一般工业技术—包装工程]