无VOC助焊剂的无铅波峰焊工艺探讨  

Technology of lead-free wave soldering with VOC-free flux

作　　者：张冰冰[1] 雷永平[1] 徐冬霞[1] 夏志东[1] 史耀武[1] 

机构地区：[1]北京工业大学材料学院先进电子连接材料实验室,北京100022

出　　处：《电子元件与材料》2007年第8期1-4,共4页Electronic Components And Materials

基　　金："十一五"国家科技支撑重点资助项目;"含有毒有害材料元素材料替代技术"国家"863"资助项目(2002AA322040);北京市教育委员会资助项目(2002KJ020)

摘　　要：概述了一种新型绿色助焊剂——无挥发性有机化合物(VOC)助焊剂。该助焊剂有无松香、无卤素、免清洗、无污染、方便储存和运输等优点,已经成为助焊剂领域的发展方向。讨论了此助焊剂在无铅波峰焊中应用时需要注意的问题。结果表明,当电路板的预热温度控制在110～120℃,轨道倾角控制在5°～7°,印制板引线脚与焊料的接触时间3～5 s,焊接温度260℃并采用喷雾涂敷方法时,可达到理想的焊接效果。A novel flux, VOC-free flux was summarized, which is already becoming the future orientation in the development of flux, for its characteristics of rosin-free, halogen-free, no-clean, environment friendly, facilities in storage and transportation. Furthermore, questions of issues had been discussed when VOC-free flux was applied in lead-free wave soldering. The idealized welding conditions are introduced as, 260 ℃ （welding temperature）, spray coating, with ranging the warm-up temperature from 110 - 120 ℃, orbit obliquity between 5°- 7° and raising contacting time of a lead feet and solder from 3-5 s.

关 键 词：电子技术 无铅焊料 综述 无VOC助焊剂 波峰焊 

分 类 号：TN305.93[电子电信—物理电子学]