无铅焊膏用助焊剂的制备与研究  

Study of a new flux for lead-free solder paste

作　　者：李国伟[1] 雷永平[1] 夏志东[1] 史耀武[1] 徐冬霞[1] 

机构地区：[1]北京工业大学材料学院先进电子连接材料实验室,北京100022

出　　处：《电子元件与材料》2007年第8期24-27,共4页Electronic Components And Materials

基　　金：国家"863"计划资助项目(2002AA322040);北京市教育委员会资助项目(2002KJ020);北京市自然科学基金资助项目(2012003)

摘　　要：无铅焊膏用助焊剂需要一定的黏性,选择有机酸和有机胺混合作为活性物质,配合一定量的松香配制出一种助焊剂。通过控制助焊剂中松香的含量,降低不挥发物的含量,减少残留物对元器件的腐蚀。依据标准对所配制的助焊剂进行了性能测试,并与一种松香含量较高的助焊剂比较。结果表明:助焊剂的松香含量降低约10%,在260℃焊接后不挥发物含量降低了近6%,黏度较好,无卤化物,无毒,环保,符合焊膏用助焊剂的要求。Active agent mixed with organic acid and organic amine were applied to keep good viscosity of flux for lead-free solder paste. In order to reduce the corrosion of components caused by the residue, the amount of rosin was controlled, It reduced significantly the amount of non-volatile matter. The properties of this flux were tested according to the industry standard, and compared with a flux which contains a high amount of rosin. The results show that when the amount of rosin decreased about 10 %, the amount of non-volatile matter reduced by 6 % after 260 ℃ welding, the flux is good viscosity, and it is halogen-free, nontoxic and environmentally friendly, thus it meets the needs of lead-free solder paste.

关 键 词：电子技术 助焊剂 无铅焊膏 松香 不挥发物 

分 类 号：TQ323.3[化学工程—合成树脂塑料工业]