半导体光源器件的金属化耦合封装  

Metallized Package of Semiconductor Light Source Devices

作　　者：杜普君 郑云生 邱向东 杨仲琪 樊承钧 

出　　处：《光通信研究》1990年第4期40-47,共8页Study on Optical Communications

摘　　要：本文介绍长波长光源器件的金属化耦合封装工艺,并通过工艺试验和生产实践,对采用新工艺制作的产品进行了可靠性考核,其结果表明这种工艺是成功的。尤其是采用YAG激光焊接技术,较好的解决了光纤定位工艺。In this paper, the metallized package workmanship of long wavelength light source devices is described. The reliability of the novel products made with this process has passed the proof test and achieved successful result. In particular, YAG laser welding technique has satisfied the fiber positioning process.

关 键 词：半导体 光源器件 金属化 耦合封装 

分 类 号：TN383[电子电信—物理电子学]