一种采用半导体致冷的集成大功率LED  

An Integrated High-power LED Refrigerated by Semiconductor

作　　者：唐政维[1] 黄琼[1] 赵赞良[1] 关鸣[1] 李秋俊[1] 董会宁[1] 蔡雪梅[1] 

机构地区：[1]重庆邮电大学光电工程学院,重庆400065

出　　处：《半导体光电》2007年第4期471-473,543,共4页Semiconductor Optoelectronics

基　　金：重庆市科技攻关项目

摘　　要：介绍了一种采用半导体致冷技术散热的集成大功率发光二极管(LED),这种利用珀尔贴效应设计的大功率LED散热封装结构,不但可以从根本上解决大功率集成LED器件的散热问题,还可以使LED器件在高温、震荡等恶劣环境中正常工作。这样,既可拓宽LED的运用领域,又能有效延长大功率LED的寿命。采用该封装技术封装的白光LED,发光稳定,光衰小,寿命长。An integrated high-power LED using semiconductor refrigeration technology to dissipate heat is introduced, This semiconductor refrigeration encapsulation structure of highpower LED which is based on the principle of Peltier effect can not only cool the high-power integrated device apparatus, but also enable the apparatus to work properly in unfavorable environment such as high temperature and tremor. Thus the semiconductor can broaden the application field of LED and extend the validity of high-power LED at the same time. White-light LED packaged in this technology have stable luminescence, small attenuation and extended lifetime.

关 键 词：大功率LED 半导体致冷 珀尔贴效应 散热 封装结构 

分 类 号：TN312.8[电子电信—物理电子学]