IC芯片粘片机并联焊头机构的插补算法及误差分析  

Interpolating Algorithm and Error Analysis for the Parallel Bonding Mechanism of IC Chip Die

作　　者：彭卫东[1] 陈新[1] 李克天[1] 郑德涛[1] 温兆麟[1] 

机构地区：[1]广东工业大学机电工程学院

出　　处：《机床与液压》2007年第9期1-2,54,共3页Machine Tool & Hydraulics

基　　金：国家自然科学基金(50475044);教育部科技研究重点项目(2004106);高等学校博士学科点专项科研基金(20040562005);广东省自然科学基金(04300155);广州市科技项目(2004Z3-D9021)

摘　　要：针对所设计的IC芯片粘片机的并联焊头机构,对其在平面上任意曲线的插补算法进行了分析。利用驱动轴的PVT插补规律和对分式原则对并联焊头机构运动轨迹的插补误差进行了计算,并通过Matlab软件进行了仿真。结果表明,轨迹的插补误差与插补直线的斜率、所分的段数和焊头机构的位置有关。Based on the designed parallel bonding mechanism of IC chip die, the interpolating algorithm on random curve of plane was analysed. Using the PVT interpolating rule and the dichotomizing principle, the interpolating error about moving orbit of the parallel bonding mechanism was calculated and the simulation was made by Matlab software. Result indicates that the interpolating error is related to the slope of interpolated line and quantity of divided sect as well as the position of the parallel bonding mechanism.

关 键 词：并联焊头机构 PVT插补规律 对分式原则 插补算法 

分 类 号：TG659[金属学及工艺—金属切削加工及机床]